3D chiplet packaging graphic showing thermal stress on a processor stack

INNOVATION

27 Jun 2025

Siemens Pushes 3D Packaging to the Forefront

Siemens unveils 3D packaging tools that slash design risks and deliver faster, more reliable chiplet integration.

Synopsys and Samsung logos over glowing AI chip design graphic

TECHNOLOGY

19 Jun 2025

Chip Design Just Got 10× Faster With AI

Al speeds Samsung-Synopsys chip design by 10x, with sharper signal integrity and certified efficiency gains.

Hand touching cloud interface graphic showing chiplet design collaboration and digital architecture tools

PARTNERSHIPS

13 Jun 2025

A Flexible Future: QuickLogic Joins Intel Chiplet Alliance

QuickLogic joins Intel’s Chiplet Alliance, boosting flexible chiplet design on Intel’s 18A process.

Qualcomm sign displayed outside headquarters

INVESTMENT

10 Jun 2025

Inside Qualcomm's $2.4B Move to Rule Al Chips

Qualcomm's Alphawave deal secures key chiplet IP and intensifies the fight for Al computing power.

Lightmatter Passage M1000 optical chip mounted on circuit board with photonic interconnects

INNOVATION

2 Apr 2025

America's Bright Idea: Optical Chips to Power Al Future

Lightmatter's optical chip swaps wires for light, promising faster Al with lower energy costs and a strategic U.S. hardware boost.

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