Meet Our Featured Speakers

calling all speakers

CHIPLET USA 2026 is accepting paper submissions broadly focused on the following key topics: 

  • Emerging trends in advanced packaging for AI, HPC, and automotive chips
  • Innovative chiplet architectures and universal die-to-die integration
  • Breakthroughs in 2.5D/3D integration, hybrid bonding, and backside power
  • Scaling advanced substrates, high-bandwidth memory, and thermal solutions
  • Case studies on heterogeneous integration led by top fabs and OSAT partners
  • Navigating policy, standards, and secure chiplet ecosystem in the chips era

CHIPLET USA 2026 offers a unique opportunity to address key challenges in advanced packaging and chiplet integration, aiming to improve performance, scalability, and cost-efficiency for next-generation semiconductor applications.

be a part of our multi-disciplined agenda...

CHIPLET USA 2026 provides a platform for semiconductor experts to share insights, exchange ideas, and present breakthroughs in chiplet architectures and advanced packaging technologies. The conference facilitates networking among semiconductor OEMs, foundries, and industry leaders, and covers topics including heterogeneous integration, high-yield manufacturing case studies, interconnect standards, and other timely and relevant research.

Collaborate with leading experts, enhance your professional profile, and contribute to shaping the future of the semiconductor industry.

Network

Network

Connect with industry peers and experts to build valuable relationships. An opportunity to build your professional network in an environment fostering growth and collaboration.

Learn

Learn

Engage with leading tech and businesses in the current landscape. Join industry thought leaders tackling major challenges, and dive into deeper discussions on cutting-edge topics.

Lead Generation

Lead Generation

Discover and connect with key industry players relevant to your business. Generate significant leads and broaden your corporate reach, enhancing your presence in the global market.

Amplify

Amplify

Join an exclusive gathering that draws journalists from top media outlets like Bloomberg, Financial Times, Forbes, and CNN Business. Elevate your message to a global audience.

Quick Proposal

SUBSCRIBE FOR UPDATES

By submitting, you agree to receive email communications from the event organizers, including upcoming promotions and discounted tickets, news, and access to related events.