Meet Our Featured Speakers

benefits

CHIPLET USA 2026 offers leading market intelligence and expert industry speakers covering the latest advancements in chiplet technologies and advanced packaging methods, providing direct insights from industry leaders to help optimize semiconductor innovation.

Benefits of attending include:

Two days of in-depth presentations revealing the latest market intelligence and sharing industry results and experiences.
An exclusive networking opportunity to connect with key industry decision-makers, semiconductor innovators, and advanced packaging technology providers to build strategic partnerships.
Receive updates on critical U.S. semiconductor initiatives and research from leading chiplet experts, presenting insights from their experiences, findings, and latest proposals.
Technical presentations from service providers highlighting recent technological advancements, test results, and innovative chiplet integration methods.
New industry case studies showcasing practical semiconductor packaging solutions and successful implementations by prominent U.S. semiconductor firms.
Unique opportunity to connect with a broad range of industry stakeholders and explore new techniques for addressing challenges in the semiconductor industry.

key takeaways

Gain a clear understanding of the evolving market dynamics shaping the semiconductor industry and their potential impact on your business
Learn how to develop strategies for effectively leveraging chiplet technologies to enhance performance and scalability within semiconductor operations
Explore the latest industry trends with an overview of the current year and projections for the years ahead
Discuss key packaging innovations, technological developments, and process advancements that are critical to enhancing semiconductor performance
Access a range of ideas and perspectives from multiple markets and allied industries, incorporating regional insights and experiences

who should attend?

This event is intended for semiconductor OEMs, foundries, OSATs, government agencies, and policy think tanks seeking to explore the benefits of advanced packaging and chiplet technologies to improve performance, scalability, and cost efficiency in U.S. semiconductor manufacturing.

Core attendees include CEOs, COOs, CFOs, Presidents, Vice Presidents, Directors, Heads of, Superintendents, and Managers involved in:

Chiplet Design Advanced Packaging EDA Toolflow IC Architecture Substrate Engineering Thermal Management Die-to-Die Integration Assembly & Test Quality Assurance Reliability Engineering Process Development Materials Research Materials Sourcing Semiconductor Manufacturing Yield Enhancement Supply Chain Purchasing & Sourcing Logistics & Distribution Compliance & Standards Policy & Regulatory Strategy & Public Policy Business Development Innovation & Technology Customer Support

they've attended our events

John Shutty

Borgwarner

"The speakers covered key topics, including trends, tools, regulations, and advancements."

Rice Kampfes

P3 Group

"It was a great event to meet people and companies, and we made valuable new connections."

Takishiko Akita

Toyota Technological Institute

"I gained fresh insights into global trends and built strong international networks."

Peter Spence

Matric

"The conference featured highly influential stakeholders."

Amit Mehta

NODAR

"It was an excellent forum with engaging and relevant speakers, and I look forward to next year."

Anurag Shrivastava

MulticoreWare

"The sessions offered learnings into the market and showed adoption is accelerating."

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