A Flexible Future: QuickLogic Joins Intel Chiplet Alliance

QuickLogic joins Intel’s Chiplet Alliance, boosting flexible chiplet design on Intel’s 18A process.

13 Jun 2025

QuickLogic is tightening its ties with Intel in a move that could reshape how chiplets are built and deployed. On June 10, the company joined the Intel Foundry Chiplet Alliance, a partnership designed to accelerate the development of interoperable semiconductor components.

The step builds on QuickLogic’s earlier work with Intel, where its customer-definable eFPGA Hard IP was already being developed on Intel’s cutting-edge 18A process node. Now, as part of the alliance, QuickLogic gains early access to Intel’s process and packaging roadmaps, along with training resources and multi-project wafer runs that can reduce both costs and turnaround times.

At the heart of the collaboration is chiplet interoperability. QuickLogic’s reconfigurable logic blocks will be able to sit alongside dies from other alliance members inside multi-chip packages, aided by industry standards like UCIe. That flexibility is critical as manufacturers look for faster, more modular ways to design systems that can serve both defense needs and rapidly evolving commercial markets.

The shift also signals a broader ambition. QuickLogic is moving beyond supplying IP to actively co-developing chiplet-based solutions with partners. The approach offers not just speed and efficiency but also a potential boost in security, an area where adaptability matters as much as raw performance.

Challenges still loom, from technical hurdles to market adoption. Yet for QuickLogic, the alliance represents more than a partnership. It is a stake in the future of semiconductor design, where openness and agility could define the next competitive edge.