CHIPLET
USA 2026

Welcome to CHIPLET USA 2026, where leading semiconductor experts will meet to explore breakthroughs in chiplet architectures and advanced packaging that are essential to sustaining U.S. leadership.

The industry is facing rising performance demands, strict energy efficiency goals, and increasing cost pressures, which make traditional scaling methods insufficient. This event will highlight solutions such as heterogeneous integration, 3D stacking, UCIe interconnects, and modular chiplet designs to drive the next wave of innovation.

Join us to gain practical insights, strengthen your chiplet strategy with innovative approaches, and reach technical excellence at the forefront of semiconductor progress.

Emerging trends in advanced packaging for AI, HPC, and automotive chips

Explore how AI, HPC, and automotive ECUs drive bandwidth, thermal, and reliability demands, reshaping chiplet packaging and U.S. manufacturing roadmaps.

Breakthroughs in 2.5D/3D integration, hybrid bonding, and backside power

Examine TSV-less stacking, hybrid Cu-Cu bonding, BSPDN, and active silicon interposers that accelerate chiplet integration and advanced packaging performance.

Case studies on heterogeneous integration led by top fabs and OSAT partners

Showcase real-world chiplet integration from leading fabs and OSATs, highlighting design challenges, yield gains, and scalable advanced packaging strategies.

Innovative chiplet architectures and universal die-to-die integration

Discuss modular chiplet architectures, UCIe 2.0, and multi-vendor integration fueling the rise of a plug-and-play chiplet ecosystem.

Scaling advanced substrates, high-bandwidth memory, and thermal solutions

Deep dive into substrate breakthroughs, HBM4 stacking, thermal advances, and cooling innovations driving performance and reliability in high-power chiplets.

Navigating policy, standards, and secure chiplet ecosystem in the chips era

Assess the CHIPS Act’s impacts, evolving standards, compliance hurdles, and policy drivers shaping growth in advanced semiconductor packaging.

Expert Speakers

Past Attendees

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