CHIPLETS
USA 2026
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Meet Our Featured Speakers
Corey Clothier
Arcadis
Sudeep Fadadu
Aurora
Corey Clothier
Arcadis
Adam Raviv
Sidley Austin LLP
THE PREMIER FORUM FOR ADVANCED PACKAGING AND CHIPLET ECOSYSTEM
Welcome to CHIPLETS USA 2026, where leading semiconductor experts will meet to explore breakthroughs in chiplet architectures and advanced packaging that are essential to sustaining U.S. leadership.
The industry is facing rising performance demands, strict energy efficiency goals, and increasing cost pressures, which make traditional scaling methods insufficient. This event will highlight solutions such as heterogeneous integration, 3D stacking, UCIe interconnects, and modular chiplet designs to drive the next wave of innovation.
Join us to gain practical insights, strengthen your chiplet strategy with innovative approaches, and reach technical excellence at the forefront of semiconductor progress.
key topics for
Emerging trends in advanced packaging for AI, HPC, and automotive chips
Explore how AI, HPC, and automotive ECUs drive bandwidth, thermal, and reliability demands, reshaping chiplet packaging and U.S. manufacturing roadmaps.
Breakthroughs in 2.5D/3D integration, hybrid bonding, and backside power
Examine TSV-less stacking, hybrid Cu-Cu bonding, BSPDN, and active silicon interposers that accelerate chiplet integration and advanced packaging performance.
Case studies on heterogeneous integration led by top fabs and OSAT partners
Showcase real-world chiplet integration from leading fabs and OSATs, highlighting design challenges, yield gains, and scalable advanced packaging strategies.
Innovative chiplet architectures and universal die-to-die integration
Discuss modular chiplet architectures, UCIe 2.0, and multi-vendor integration fueling the rise of a plug-and-play chiplet ecosystem.
Scaling advanced substrates, high-bandwidth memory, and thermal solutions
Delve into substrate breakthroughs, HBM4 stacking, thermal advances, and cooling innovations driving performance and reliability in high-power chiplets.
Navigating policy, standards, and secure chiplet ecosystem in the chips era
Assess the CHIPS Act’s impacts, evolving standards, compliance hurdles, and policy drivers shaping growth in advanced semiconductor packaging.
INDUSTRY TOPICS
NETWORKING EVENTS
LEADING EXPERTS
Q&A SESSIONS
Latest News
PARTNERSHIPS
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Chiplet Alliance Puts US Packaging Back in PlayINNOVATION
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Inside the US Bid to Reinvent Chip Packaging for AIINSIGHTS
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Chiplets Take the Lead in the Silicon RaceINSIGHTS
23 Aug 2025
Arm Bets on Chiplets to Rewrite the Future of Chips
America’s Chiplet Strategy Gets a Trust Upgrade with AuthenTree
RESEARCH
19 Aug 2025
AuthenTree’s distributed trust model may help secure multi-vendor chiplets and strengthen US chip supply chains under the CHIPS Act.
they've attended our events
Expert Speakers
Corey Clothier
Arcadis
Bodo Seifert
TUV Rheinland
Adam Raviv
Sidley Austin LLP
Past Attendees
American Honda Motor Inc.
Arcadis
North American Lighting
TUV Rheinland
CHT USA Inc.
Voltera
Zendar
Sidley Austin LLP
Aurora
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