Latest News

  • RESEARCH

    13 Mar 2026

    A Phone-Size Superchip? Intel Thinks So

  • INVESTMENT

    9 Mar 2026

    Reno’s Positron Joins the AI Chip Unicorn Club

  • MARKET TRENDS

    5 Mar 2026

    Silicon Breaks Apart as Chiplets Take Center Stage

  • INSIGHTS

    2 Mar 2026

    U.S. Alliance Targets AI Chip Packaging Shift

Beneath the Surface of the CHIPS Act

Semiconductor chip featuring US flag on motherboard

REGULATORY

26 Feb 2026

A proposed Texas hub signals a broader US push to secure rare earths at the root of semiconductor supply chains

Large semiconductor packaging facility in Arizona with solar canopies and desert landscape.

INVESTMENT

15 Dec 2025

Arizona Stakes Its Claim in the Chip Supply Chain

Amkor’s $7B Peoria campus brings advanced chip packaging to U.S. soil, reshaping supply chains and AI hardware by 2028

Robotic tool placing processors onto advanced chip packaging substrate

INNOVATION

12 Dec 2025

How the Humble Chip Package Became an AI Power Play

AI demand is turning advanced packaging into the next big battleground in US chipmaking

Semiconductor packaging line with robotic arms assembling a circuit board.

MARKET TRENDS

11 Dec 2025

Inside the High-Stakes Battle for America’s Chip Future

TSMC, Amkor, and Intel fuel US packaging growth as AI drives a manufacturing revival

TSMC logo displayed on exterior wall of semiconductor manufacturing facility

TECHNOLOGY

10 Dec 2025

US Packaging Push Sparks Battle for AI’s Future

Amkor and TSMC expand US chip packaging to anchor AI growth and secure supply chains

Layered chiplet and semiconductor graphics illustrating advanced multi die packaging technology.

PARTNERSHIPS

18 Nov 2025

Chiplet Alliance Puts US Packaging Back in Play

Intel's expanding chiplet alliance boosts US packaging capacity and accelerates multi die innovation with new support for UCIe interoperab...

Advanced semiconductor factory complex supporting AI chip production

INNOVATION

14 Nov 2025

Inside the US Bid to Reinvent Chip Packaging for AI

US advances in glass and silicon substrates fuel a fast climb in AI hardware capacity

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