Close-up of Nvidia semiconductor chip reflecting advanced packaging bottlenecks

MARKET TRENDS

8 Jan 2026

The Chip Bottleneck Nobody Can Ignore Anymore

As chip demand surges, advanced packaging has become a bottleneck and a strategic asset, reshaping U.S. supply chains and investment prior...

Tenstorrent acquires Blue Cheetah to expand AI interconnect technology

PARTNERSHIPS

6 Jan 2026

How Interconnects Turned Into the New AI Chokepoint

Tenstorrent’s July 2025 deal for Blue Cheetah highlights how interconnect control is emerging as a key lever in AI chip design

ASE semiconductor advanced packaging facility supporting AI chip production

INSIGHTS

5 Jan 2026

Why AI Chips Are Turning Packaging Into a Power Play

Rising demand for AI hardware is tightening advanced packaging capacity and driving investment by groups such as ASE

National Institute of Standards and Technology sign at a US research campus.

REGULATORY

18 Dec 2025

Why Chiplets Are Suddenly Central to US Chip Policy

Federal incentives for advanced packaging are steering chipmakers to localise R&D and align supply chains around chiplet technologies

Close-up of advanced chiplet hardware on a semiconductor substrate, illustrating UCIe 3.0 interoperability themes.

INNOVATION

17 Dec 2025

Can UCIe 3.0 Unite the Chiplet Industry?

New standard aims to ease chiplet interoperability, though commercial uptake is expected to be gradual

UCIe logo representing Universal Chiplet Interconnect Express standard

PARTNERSHIPS

16 Dec 2025

Can Shared Chiplet Rules Spark a New Tech Boom?

UCIe adoption improves interoperability as advanced packaging ecosystems mature

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