Latest News

  • INVESTMENT

    12 Jan 2026

    Inside GlobalFoundries’ High-Stakes Chiplet Gamble

  • MARKET TRENDS

    8 Jan 2026

    The Chip Bottleneck Nobody Can Ignore Anymore

  • PARTNERSHIPS

    6 Jan 2026

    How Interconnects Turned Into the New AI Chokepoint

  • INSIGHTS

    5 Jan 2026

    Why AI Chips Are Turning Packaging Into a Power Play

Why Chiplets Are Suddenly Central to US Chip Policy

National Institute of Standards and Technology sign at a US research campus.

REGULATORY

18 Dec 2025

Federal incentives for advanced packaging are steering chipmakers to localise R&D and align supply chains around chiplet technologies

Advanced semiconductor factory complex supporting AI chip production

INNOVATION

14 Nov 2025

Inside the US Bid to Reinvent Chip Packaging for AI

US advances in glass and silicon substrates fuel a fast climb in AI hardware capacity

Close-up of a CPU socket on a motherboard highlighting advanced chiplet-ready semiconductor hardware.

INSIGHTS

10 Nov 2025

Chiplets Take the Lead in the Silicon Race

Silicon Box’s milestone shows chiplet packaging moving mainstream as U.S. firms scale local capacity

Person holding an Arm-branded processor chip representing Arm’s entry into chiplet hardware development

INSIGHTS

23 Aug 2025

Arm Bets on Chiplets to Rewrite the Future of Chips

UK-based designer, Arm moves into chipmaking as demand for AI and US industrial policy reshape market

Chiplet design illustration showing modular dies on a substrate for secure multi-vendor integration

RESEARCH

19 Aug 2025

America’s Chiplet Strategy Gets a Trust Upgrade with AuthenTree

AuthenTree’s distributed trust model may help secure multi-vendor chiplets and strengthen US chip supply chains under the CHIPS Act.

3D illustration of chiplets on a semiconductor board with high-speed data pathways

MARKET TRENDS

10 Aug 2025

Can UCIe 3.0 Give the U.S. a Chiplet Edge?

New chiplet standard promises faster, leaner designs and a stronger U.S. edge in the semiconductor race.

CHIPS for America logo styled as a semiconductor chip with U.S. flag elements

REGULATORY

6 Aug 2025

Faster, Stronger, Sharper: The Rise of UCIe 3.0

Intel, AMD, and TSMC join UCIe 3.0 rollout, boosting chiplet speed and cross-vendor interoperability.

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