Latest News

  • REGULATORY

    26 Feb 2026

    Beneath the Surface of the CHIPS Act

  • PARTNERSHIPS

    24 Feb 2026

    Silicon Catalyst Expands Quantum Playbook

  • INSIGHTS

    16 Feb 2026

    Can Cadence’s New Ecosystem Accelerate AI Silicon?

  • RESEARCH

    13 Feb 2026

    AI Digital Twins Race to Boost Chip Yields

AI Takes the Helm in America’s Chip Race

KLA corporate office linked to AI-driven chip inspection technology

INNOVATION

11 Feb 2026

Smart factories use AI to lift yields, cut downtime, and sharpen US semiconductor competitiveness

Close-up of a semiconductor chip mounted on an advanced circuit board

RESEARCH

16 Jan 2026

Hybrid Bonding Moves From Niche to AI Necessity

As AI workloads surge, hybrid bonding edges closer to high-volume manufacturing and reshapes the future of advanced chip packaging

Exterior view of a GlobalFoundries chip manufacturing plant

INVESTMENT

12 Jan 2026

Inside GlobalFoundries’ High-Stakes Chiplet Gamble

US foundry expands into photonics, optics and power as packaging and integration gain weight in chip design

Close-up of Nvidia semiconductor chip reflecting advanced packaging bottlenecks

MARKET TRENDS

8 Jan 2026

The Chip Bottleneck Nobody Can Ignore Anymore

As chip demand surges, advanced packaging has become a bottleneck and a strategic asset, reshaping U.S. supply chains and investment prior...

Tenstorrent acquires Blue Cheetah to expand AI interconnect technology

PARTNERSHIPS

6 Jan 2026

How Interconnects Turned Into the New AI Chokepoint

Tenstorrent’s July 2025 deal for Blue Cheetah highlights how interconnect control is emerging as a key lever in AI chip design

ASE semiconductor advanced packaging facility supporting AI chip production

INSIGHTS

5 Jan 2026

Why AI Chips Are Turning Packaging Into a Power Play

Rising demand for AI hardware is tightening advanced packaging capacity and driving investment by groups such as ASE

National Institute of Standards and Technology sign at a US research campus.

REGULATORY

18 Dec 2025

Why Chiplets Are Suddenly Central to US Chip Policy

Federal incentives for advanced packaging are steering chipmakers to localise R&D and align supply chains around chiplet technologies

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