Latest News

  • INVESTMENT

    12 Jan 2026

    Inside GlobalFoundries’ High-Stakes Chiplet Gamble

  • MARKET TRENDS

    8 Jan 2026

    The Chip Bottleneck Nobody Can Ignore Anymore

  • PARTNERSHIPS

    6 Jan 2026

    How Interconnects Turned Into the New AI Chokepoint

  • INSIGHTS

    5 Jan 2026

    Why AI Chips Are Turning Packaging Into a Power Play

Why Chiplets Are Suddenly Central to US Chip Policy

National Institute of Standards and Technology sign at a US research campus.

REGULATORY

18 Dec 2025

Federal incentives for advanced packaging are steering chipmakers to localise R&D and align supply chains around chiplet technologies

UCIe logo representing Universal Chiplet Interconnect Express standard

PARTNERSHIPS

16 Dec 2025

Can Shared Chiplet Rules Spark a New Tech Boom?

UCIe adoption improves interoperability as advanced packaging ecosystems mature

Large semiconductor packaging facility in Arizona with solar canopies and desert landscape.

INVESTMENT

15 Dec 2025

Arizona Stakes Its Claim in the Chip Supply Chain

Amkor’s $7B Peoria campus brings advanced chip packaging to U.S. soil, reshaping supply chains and AI hardware by 2028

Robotic tool placing processors onto advanced chip packaging substrate

INNOVATION

12 Dec 2025

How the Humble Chip Package Became an AI Power Play

AI demand is turning advanced packaging into the next big battleground in US chipmaking

Semiconductor packaging line with robotic arms assembling a circuit board.

MARKET TRENDS

11 Dec 2025

Inside the High-Stakes Battle for America’s Chip Future

TSMC, Amkor, and Intel fuel US packaging growth as AI drives a manufacturing revival

TSMC logo displayed on exterior wall of semiconductor manufacturing facility

TECHNOLOGY

10 Dec 2025

US Packaging Push Sparks Battle for AI’s Future

Amkor and TSMC expand US chip packaging to anchor AI growth and secure supply chains

Layered chiplet and semiconductor graphics illustrating advanced multi die packaging technology.

PARTNERSHIPS

18 Nov 2025

Chiplet Alliance Puts US Packaging Back in Play

Intel's expanding chiplet alliance boosts US packaging capacity and accelerates multi die innovation with new support for UCIe interoperab...

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