INVESTMENT
Siemens buys Canopus AI to push intelligence deeper into chip production, betting software will decide the next manufacturing winners
9 Feb 2026

Siemens has signalled that it sees the next advance in semiconductor manufacturing coming as much from software as from new equipment, with its acquisition of Canopus AI, a specialist in inspection and measurement tools for chip production.
The deal, completed in January and disclosed in early February, brings machine learning capabilities into Siemens’ semiconductor software portfolio. Financial terms were not disclosed, reflecting a broader reluctance among technology groups to put a public price on scarce artificial intelligence expertise.
As chips become smaller and more complex, manufacturers face tighter tolerances and higher risks. Minor defects can lead to significant yield losses, production delays and higher costs. Canopus AI uses machine learning to detect such issues earlier in the manufacturing process, when they are cheaper and easier to address.
Siemens plans to integrate this technology across its design and manufacturing software. The aim is to create a closer feedback loop between chip design and factory performance, allowing real world production data to inform design decisions on an ongoing basis. The company says this could help customers ramp up production more quickly and maintain consistent quality at scale.
Tony Hemmelgarn, head of Siemens Digital Industries Software, described the acquisition as a practical application of industrial AI. Pairing advanced measurement with Siemens’ wider platform, he said, would help chipmakers move from experimentation to high volume manufacturing with greater confidence.
The move comes as investment in new semiconductor fabrication plants remains strong, fuelled by demand from artificial intelligence computing, electric vehicles and data centres. At the same time, rising costs and tighter margins are forcing manufacturers to look for efficiency gains beyond the factory floor. Software, particularly tools that can optimise processes and reduce waste, has become a growing focus.
The acquisition also reflects a broader shift in the semiconductor industry towards end to end platforms. By offering a wider range of integrated tools, Siemens is seeking to position itself as a long term partner to chipmakers rather than a supplier of individual products.
Challenges remain, including integrating data across different factories and proving the benefits at scale. But Siemens’ message is clear: in advanced chipmaking, intelligence embedded in software is becoming as important as physical manufacturing capability.
16 Feb 2026
13 Feb 2026
11 Feb 2026
9 Feb 2026

INSIGHTS
16 Feb 2026

RESEARCH
13 Feb 2026

INNOVATION
11 Feb 2026
By submitting, you agree to receive email communications from the event organizers, including upcoming promotions and discounted tickets, news, and access to related events.