CHIPLETS USA 2026 is the premier forum for stakeholders across the advanced packaging value chain, including semiconductor OEMs, foundries, OSATs, government agencies, and policy think tanks, to discuss and examine the evolving landscape of chiplet integration. From fan-out panel-level packaging to next-generation interposers, the focus is now on collaborative engineering, advanced inspection, and material innovations to unlock the full potential of chiplet ecosystems.
The Rise of Fan-Out and Panel-Level Packaging
The most significant advances in chiplet packaging are now driven by fan-out wafer-level and panel-level approaches, which rival traditional silicon interposer designs in I/O density and thermal efficiency. Major players are racing to scale up panel-level processes that can accommodate up to nine reticle-sized dies on a single glass-core substrate. These platforms deliver exceptional performance scaling, greater design flexibility, and a smaller package footprint, all critical for next-generation AI, HPC, and 5G applications.
Built-In DfX and Reliability by Design
With greater integration complexity comes an urgent need for Design-for-Excellence methodologies. Built-in DfX hooks now enable real-time in-line monitoring, while advanced simulation tools safeguard signal and power integrity throughout the assembly flow. Chiplet-based packaging is no longer just a design challenge; it is a manufacturing and reliability imperative. In-line X-ray and CT-based inspection are emerging as the standard for high-density fan-out packages, enabling early defect detection and process optimization.
These improvements are more than technical milestones; they mark an industry-wide shift toward robust, scalable solutions that can meet the quality and longevity requirements of mission-critical sectors. New underfill chemistries, advanced redistribution layer architectures, and thermal interface materials are all contributing to automotive-grade package lifetimes, even in highly miniaturized formats.
Capitalizing on Thermal and Power Efficiency
For packaging engineers and decision-makers, one of the clearest returns on investment is managing power delivery and thermal dissipation. Intelligent integration of thermal vias, power delivery networks, and passive components directly into the package substrate reduces thermal bottlenecks and voltage drops, ensuring stronger chiplet-to-chiplet coherence and overall system stability. By lowering the need for active cooling and enhancing thermal cycling performance, manufacturers can achieve meaningful reductions in total cost of ownership.
Moreover, the shift to glass-core substrates and silicon bridges is opening new opportunities for vertical and lateral stacking, enabling architectures that were once limited by substrate material constraints. These innovations are reshaping the relationship between package form factor and system-level performance.
Investing in High-Reliability Packaging Infrastructure
As the semiconductor industry adopts chiplet-based architectures at scale, investments in advanced packaging infrastructure are expected to grow substantially. Equipment manufacturers and materials suppliers estimate a market opportunity of more than US$620 billion through 2030, driven largely by the demand from hyperscalers, automotive suppliers, and consumer electronics leaders. Companies that strengthen their packaging R&D pipelines and build new partnerships with OSATs and substrate manufacturers are positioning themselves to lead this transformation.
Leading-edge OSATs are developing modular process platforms to support faster design-to-prototype cycles. At the same time, glass-core panel substrates are moving into pilot production across multiple regions, marking a critical inflection point in the industrialization of heterogeneous integration.
Intelligent Facility Management and Process Automation
Smart fab systems and facility-level control platforms that optimize cleanroom environments, humidity, particle control, and equipment uptime are now key enablers of high-yield packaging production. Automation of sub-processes such as die attach, underfill dispense, and warpage control is improving throughput and reducing human error. By integrating AI-driven feedback loops into factory management systems, packaging fabs can dynamically adapt recipes to changing line conditions, improving yield and ensuring tighter process control.
The integration of real-time metrology, data analytics, and predictive maintenance is further reducing operational costs. Recent studies show that overall packaging line efficiency can improve by as much as 38 percent through full-stack digitalization and adaptive control.
Enabling a Chiplet-Centric Future
The transition to chiplet architecture is more than a technology evolution; it is a strategic reorientation of the entire semiconductor value chain. CHIPLETS USA 2026 will unite thought leaders, technologists, and policymakers to examine how cross-industry collaboration, ecosystem standardization, and investment in advanced packaging can sustain long-term innovation.
Whether you are a packaging technologist, system architect, substrate developer, or government strategist, this event offers an opportunity to help shape a more agile, high-performance, and sustainable semiconductor future. Exhibitors and partners at CHIPLETS USA 2026 will showcase breakthroughs in design enablement, materials science, automated inspection, and high-volume manufacturing, all aimed at delivering the next generation of chiplet-powered systems.
